The Florida-based backend specialist provides WIN clients with an extra U.S. option for wafer grinding, thinning, dicing, pick-and-place, and die inspection
WIN Semiconductors Corp. (TPEx:TPEx: 3105)
Bringing SawStreet into the WIN Alliance offers our clients a different backend processing route and strengthens the support structure for those aiming to shorten total wafer processing turnaround.— Russ Wagner, Vice President of Business Development, WIN SemiconductorsTAOYUAN, TAIWAN, October 5, 2026 /EINPresswire.com/ — WIN Semiconductors Corp (TPEx: 3105), the leading global pure-play compound semiconductor foundry, revealed today that Orlando, Florida-headquartered SawStreet LLC has joined the WIN Alliance Partner Program. This collaboration enhances WIN’s internal backend operations, offering customers another dependable collaborator for wafer grinding and thinning, dicing, pick-and-place, and die inspection.
SawStreet manages thicknesses down to 50 µm, with expertise in wafer grinding and thinning, including dice-before-grind (DBG), alongside precision dicing, rapid pick & place, and visual die inspection meeting MIL-STD-883 Condition A or B, or client-specific internal standards.
“We are honored to be asked to join the WIN Alliance,” stated Jim Young, President and CEO of SawStreet LLC. “SawStreet has dedicated years to processing GaAs, GaN and InP wafers for rigorous commercial, defense and space initiatives, and we recognize the immense value carried by each wafer as it exits a facility like WIN’s. Becoming part of the Alliance gives WIN clients a U.S.-located partner for backend processing, complete with the rapid-turnaround timelines and careful handling those projects demand.”
Russ Wagner, Vice President of Business Development for WIN Semiconductors, noted, “Integrating SawStreet into the WIN Alliance provides our clients with an alternative backend processing option that supplements the offerings WIN already delivers. Their proficiency adds an additional tier of assistance for clients seeking to shorten overall wafer processing turnaround time.”
About SawStreet LLC
SawStreet is a privately held, fast-turnaround semiconductor backend service provider situated in Orlando, Florida. The firm delivers grinding, dicing, pick-and-place and inspection services tailored to the strict needs of defense, aerospace and RF sectors, accommodating a broad spectrum of substrates such as GaAs, InP, SiGe, GaN/SiC, fused silica and sapphire.
About WIN Semiconductors Corp.
WIN Semiconductors Corp. stands as the foremost worldwide supplier of pure-play GaAs and GaN wafer foundry services targeting the wireless, infrastructure and networking sectors. WIN equips its foundry partners with an extensive selection of Heterojunction Bipolar Transistor (HBT), Pseudomorphic High Electron Mobility Transistor (pHEMT), Gallium Nitride High Electron Mobility Transistor (GaN HEMT), PIN diode and optical device technology solutions enabling advanced products spanning 50 MHz to 170 GHz and into light-wave applications. Custom products manufactured by WIN Semiconductors Corp. are utilized across numerous industries, including smartphone, mobile infrastructure, 3D sensing, optical communications, CATV, aerospace, defense, satellite and automotive sectors.
For over 25 years, WIN has delivered foundry services from its cutting-edge, ISO 9001/14001-certified 150 mm GaAs facility based in Taoyuan City, Taiwan. WIN offers clients a broad range of device technology platforms and value-added services, including DC/RF product testing, Cu wafer bumping and advanced packaging solutions to accelerate product development. Additional details can be found at www.winfoundry.com.
Kara Harmon
WIN Semiconductors Corp.
kharmon@use.winfoundry.com
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