Earning the OCP Accepted™ recognition is a testament to our deep commitment to materials science and thermal innovation.”— Satish Mohapatra, PhD, President and CEO of DynaleneWHITEHALL, PA, UNITED STATES, August 12, 2026 /EINPresswire.com/ — Dynalene, a premier U.S. specialty manufacturer of high-performance heat transfer fluids, has officially achieved recognition under the Open Compute Project (OCP) Accepted™ program for its Dynalene PG-D25 coolant, purpose‑built for direct‑to‑chip cooling. This accomplishment reinforces the company’s dedication to advancing sustainable and efficient liquid cooling technologies for data center and high‑performance computing applications.
The Open Compute Project (OCP) is a collaborative organization that enables companies to share data center product designs and industry best practices. Founded in 2011, OCP has significantly shaped the design and operation of large‑scale computing facilities worldwide. As of 2026, more than 650 organizations globally are OCP members.
The OCP Product Recognition Program (https://www.opencompute.org/sp/product-recognition-program) formally identifies products that align with OCP‑approved contributions. Earning the OCP Accepted™ designation means a product complies with an approved OCP specification and clearly reflects the core OCP tenets of efficiency, openness, impact, scale, and sustainability.
"At Dynalene, our mission has always been to help industries operate safely, sustainably, and efficiently," said Satish Mohapatra, PhD, President and CEO of Dynalene. "Earning the OCP Accepted™ recognition is a testament to our deep commitment to materials science and thermal innovation. We are extremely proud to actively collaborate with the Open Compute Project global community to deliver scalable, open-source liquid cooling solutions that address the unprecedented thermal demands of next-generation AI data centers."
Dynalene manufactures PG-D25 coolant using high‑quality USP‑grade propylene glycol combined with a proprietary additive package engineered specifically for direct‑to‑chip cooling. It provides excellent multi‑metal corrosion protection, particularly for copper cold plates and heat exchangers used in most coolant distribution units (CDUs), and offers strong resistance against algae and bacterial growth. Dynalene PG‑D25 passes ASTM tests for heat transfer coolants (D8040), thermal stability (D7437), and coolant foaming (D1881). By adopting Dynalene's advanced liquid cooling solutions, data centers can improve Power Usage Effectiveness (PUE) and increase overall rack density. Demonstrating its high‑volume production capability, Dynalene has successfully delivered multiple large‑scale global orders of up to one million gallons per project for various applications, including data centers.
Additional details on Dynalene's complete portfolio of data center cooling solutions and its OCP community participation can be found at www.dynalene.com.
About Dynalene:
Dynalene is a global frontrunner in the development, manufacturing, and distribution of high
